SILVER PASTES

EIC Ag 04

EIC Ag 10 is a high flexibility screen-printable thermoplastic silver paste for low temperature applications. When fully cured the ink has good adhesion to a wide range of substrates including polyester, polycarbonate and glass.

 

Applications: Conductive Tracks & Counter Electrode 

Solids Content - 50%
Viscosity - 0.5.-3.0 Pas
Resistivity - 15 mΩ/□ @ 25um
Curing - 80-130°C

EIC Ag 10

EIC Ag 10 is a screen-printable thermoplastic silver paste for low temperature applications. When fully cured the ink has good adhesion to a wide range of substrates including polyester, polycarbonate and glass.

 

Applications: Conductive Tracks & Counter Electrode 

Solids Content - 60%
Viscosity - 1.0-4.0 Pas
Resistivity - 20 mΩ/□ @ 25um
Curing - 80-130°C

EIC Ag 20

EIC Ag 10 is a screen-printable silver paste for low temperature applications. When fully cured the ink has good adhesion to a wide range of substrates including polyester, polycarbonate and glass.

 

Applications: Conductive Tracks & Counter Electrode 

Solids Content - 70%

Viscosity - 7.0-9.0 Pas

Resistivity - <20 mΩ/□ @ 25um

Curing - 80-130°C

EIC Ag 03

EIC Ag 03 is a flexible  thermoset silver paste for low temperature applications. When fully cured the ink has excellent adhesion to a variety of substrate and exceptional chemical and environmental resistance.

 

Applications: Conductive Tracks & Counter Electrode 

Solids Content - 60%

Viscosity - 4.0-8.0 Pas

Resistivity - <100 mΩ/□ @ 25um

Curing - 140-150°C