SILVER PASTES
EIC Ag 04
EIC Ag 04 is a high flexibility screen-printable thermoplastic silver paste for low temperature applications. When fully cured the ink has good adhesion to a wide range of substrates including polyester, polycarbonate and glass.
Applications: Conductive Tracks & Counter Electrode
Solids Content - 50%
Viscosity - 0.5.-3.0 Pas
Resistivity - 15 mΩ/□ @ 25um
Curing - 80-130°C
EIC Ag 10
EIC Ag 10 is a screen-printable thermoplastic silver paste for low temperature applications. When fully cured the ink has good adhesion to a wide range of substrates including polyester, polycarbonate and glass.
Applications: Conductive Tracks & Counter Electrode
Solids Content - 60%
Viscosity - 1.0-4.0 Pas
Resistivity - 20 mΩ/□ @ 25um
Curing - 80-130°C
EIC Ag 20
EIC Ag 20 is a screen-printable silver paste for low temperature applications. When fully cured the ink has good adhesion to a wide range of substrates including polyester, polycarbonate and glass.
Applications: Conductive Tracks & Counter Electrode
Solids Content - 70%
Viscosity - 7.0-9.0 Pas
Resistivity - <20 mΩ/□ @ 25um
Curing - 80-130°C
EIC Ag 03
EIC Ag 03 is a flexible thermoset silver paste for low temperature applications. When fully cured the ink has excellent adhesion to a variety of substrate and exceptional chemical and environmental resistance.
Applications: Conductive Tracks & Counter Electrode